A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
MANUFACTURING METHOD OF CIRCUIT BOARD, AND MANUFACTURING DEVICE FOR CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board capable of suppressing abrasion of a die-cutting pin while suppressing defect occurrence in a ceramic green sheet.SOLUTION: The present invention relates to a manufacturing method of a circuit board comprising a ceramic layer and a wiring part that is disposed in the ceramic layer. The manufacturing method of the circuit board includes the steps of: installing a ceramic green sheet between an upper die and a lower die of a punch metal mold; arranging a resin film at a position separated upwards in relative to the ceramic green sheet between the upper die and the lower die; and opening at least one hole on the ceramic green sheet together with the film by means of the punch metal mold. In the step of opening the hole, the ceramic green sheet and the film are separated after the hole is opened.SELECTED DRAWING: Figure 1
【課題】セラミックグリーンシートにおける不良発生を抑制しつつ、打ち抜き用のピンの摩耗を抑制できる回路基板の製造方法を提供する。【解決手段】本開示は、セラミック層と、セラミック層に配置された配線部とを備える回路基板の製造方法である。回路基板の製造方法は、パンチ金型の上型と下型との間にセラミックグリーンシートを設置する工程と、上型と下型との間で、セラミックグリーンシートに対し上方に離間する位置に樹脂製のフィルムを配する工程と、パンチ金型によりフィルムと共にセラミックグリーンシートに少なくとも１つの孔を開ける工程と、を備える。孔を開ける工程では、開孔後にセラミックグリーンシート及びフィルムが離間される。【選択図】図１
MANUFACTURING METHOD OF CIRCUIT BOARD, AND MANUFACTURING DEVICE FOR CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board capable of suppressing abrasion of a die-cutting pin while suppressing defect occurrence in a ceramic green sheet.SOLUTION: The present invention relates to a manufacturing method of a circuit board comprising a ceramic layer and a wiring part that is disposed in the ceramic layer. The manufacturing method of the circuit board includes the steps of: installing a ceramic green sheet between an upper die and a lower die of a punch metal mold; arranging a resin film at a position separated upwards in relative to the ceramic green sheet between the upper die and the lower die; and opening at least one hole on the ceramic green sheet together with the film by means of the punch metal mold. In the step of opening the hole, the ceramic green sheet and the film are separated after the hole is opened.SELECTED DRAWING: Figure 1
【課題】セラミックグリーンシートにおける不良発生を抑制しつつ、打ち抜き用のピンの摩耗を抑制できる回路基板の製造方法を提供する。【解決手段】本開示は、セラミック層と、セラミック層に配置された配線部とを備える回路基板の製造方法である。回路基板の製造方法は、パンチ金型の上型と下型との間にセラミックグリーンシートを設置する工程と、上型と下型との間で、セラミックグリーンシートに対し上方に離間する位置に樹脂製のフィルムを配する工程と、パンチ金型によりフィルムと共にセラミックグリーンシートに少なくとも１つの孔を開ける工程と、を備える。孔を開ける工程では、開孔後にセラミックグリーンシート及びフィルムが離間される。【選択図】図１
MANUFACTURING METHOD OF CIRCUIT BOARD, AND MANUFACTURING DEVICE FOR CIRCUIT BOARD
回路基板の製造方法、及び回路基板の製造装置
DEGUCHI HIROYUKI (author) / YAMADA YASUHARU (author) / NOZU KAZUYA (author) / HASEGAWA MASAMI (author)
2018-11-15
Patent
Electronic Resource
Japanese
IPC:
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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