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WAFER SUPPORT
A wafer support 10 includes a base material 14 including a machinable ceramic, a protective layer 16 covering a surface of the base material, and conductive members 18 and 20 placed at least partially inside the base material. The protective layer 16 includes a material that is less corrodible by plasma than the base material 14.
WAFER SUPPORT
A wafer support 10 includes a base material 14 including a machinable ceramic, a protective layer 16 covering a surface of the base material, and conductive members 18 and 20 placed at least partially inside the base material. The protective layer 16 includes a material that is less corrodible by plasma than the base material 14.
WAFER SUPPORT
WAFERTRÄGER
SUPPORT DE TRANCHE
YAMAGISHI WATARU (author) / MORI KAZUMASA (author) / KOUNO HITOSHI (author) / ETO SHUNICHI (author)
2025-01-15
Patent
Electronic Resource
English
WAFER SUPPORT AND METHOD FOR MANUFACTURING WAFER SUPPORT
European Patent Office | 2020
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