A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
WAFER SUPPORT
To provide a novel wafer support which is excellent in corrosion resistance against plasma.SOLUTION: A wafer support 28 comprises: a base material 14 which is made of machinable ceramic; an intermediate layer 15 covering a surface of the base material; a protective layer 16 covering a surface of the intermediate layer; and a conductive member 18 at least part of which is included in the base material. The intermediate layer 15 is made of a metallic material or an alloy material whose melting point is 800°C or higher. The protective layer 16 is made of a material which is less corroded by plasma than the base material 14 is.SELECTED DRAWING: Figure 5
【課題】プラズマに対する耐食性に優れた新たなウエハ支持体を提供する。【解決手段】ウエハ支持体２８は、マシナブルセラミックスからなる基材１４と、基材の表面を覆う中間層１５と、中間層の表面を覆う保護層１６と、基材に少なくとも一部が内包された導電部材１８と、を備える。中間層１５は、融点が８００℃以上の金属材料または合金材料で構成されており、保護層１６は、基材１４よりもプラズマによる腐食が少ない材料で構成されている。【選択図】図５
WAFER SUPPORT
To provide a novel wafer support which is excellent in corrosion resistance against plasma.SOLUTION: A wafer support 28 comprises: a base material 14 which is made of machinable ceramic; an intermediate layer 15 covering a surface of the base material; a protective layer 16 covering a surface of the intermediate layer; and a conductive member 18 at least part of which is included in the base material. The intermediate layer 15 is made of a metallic material or an alloy material whose melting point is 800°C or higher. The protective layer 16 is made of a material which is less corroded by plasma than the base material 14 is.SELECTED DRAWING: Figure 5
【課題】プラズマに対する耐食性に優れた新たなウエハ支持体を提供する。【解決手段】ウエハ支持体２８は、マシナブルセラミックスからなる基材１４と、基材の表面を覆う中間層１５と、中間層の表面を覆う保護層１６と、基材に少なくとも一部が内包された導電部材１８と、を備える。中間層１５は、融点が８００℃以上の金属材料または合金材料で構成されており、保護層１６は、基材１４よりもプラズマによる腐食が少ない材料で構成されている。【選択図】図５
WAFER SUPPORT
ウエハ支持体
YAMAGISHI KO (author) / MORI KAZUMASA (author) / KONO HITOSHI (author) / ETO SHUNICHI (author)
2023-12-01
Patent
Electronic Resource
Japanese
WAFER SUPPORT AND METHOD FOR MANUFACTURING WAFER SUPPORT
| European Patent Office | 2020