A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
WAFER SUPPORT
A wafer support 28 includes a base material 14 including at least boron nitride as a machinable ceramic, a protective layer 16 covering a surface 14a of the base material, and a conductive member 18 placed at least partially inside the base material 14. The base material includes a first layer 14b and a second layer 14c between the first layer 14b and the protective layer 16. The protective layer 16 includes a material that is less corrodible by plasma than the base material 14. The following formula (1) is satisfied: 5≤W1−W2≤35 where the proportion of boron nitride contained in the first layer 14b is represented by W1 [mass%] and the proportion of boron nitride contained in the second layer 14c is represented by W2 [mass%].
WAFER SUPPORT
A wafer support 28 includes a base material 14 including at least boron nitride as a machinable ceramic, a protective layer 16 covering a surface 14a of the base material, and a conductive member 18 placed at least partially inside the base material 14. The base material includes a first layer 14b and a second layer 14c between the first layer 14b and the protective layer 16. The protective layer 16 includes a material that is less corrodible by plasma than the base material 14. The following formula (1) is satisfied: 5≤W1−W2≤35 where the proportion of boron nitride contained in the first layer 14b is represented by W1 [mass%] and the proportion of boron nitride contained in the second layer 14c is represented by W2 [mass%].
WAFER SUPPORT
WAFERTRÄGER
SUPPORT DE TRANCHE
YAMAGISHI WATARU (author) / MORI KAZUMASA (author) / KOUNO HITOSHI (author) / ETO SHUNICHI (author)
2025-02-19
Patent
Electronic Resource
English
WAFER SUPPORT AND METHOD FOR MANUFACTURING WAFER SUPPORT
| European Patent Office | 2020