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WAFER SUPPORT
A wafer support includes a base material including a machinable ceramic, a protective layer covering a surface of the base material, and conductive members and placed at least partially inside the base material. The protective layer includes a material that is less corrodible by plasma than the base material.
WAFER SUPPORT
A wafer support includes a base material including a machinable ceramic, a protective layer covering a surface of the base material, and conductive members and placed at least partially inside the base material. The protective layer includes a material that is less corrodible by plasma than the base material.
WAFER SUPPORT
YAMAGISHI WATARU (author) / MORI KAZUMASA (author) / KOUNO HITOSHI (author) / ETO SHUNICHI (author)
2024-05-30
Patent
Electronic Resource
English