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CERAMIC CYLINDRICAL TYPE SPUTTERING TARGET MATERIAL, AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a ceramic cylindrical type sputtering target material which is long-sized and has high density.SOLUTION: There is provided a ceramic cylindrical type sputtering target formed by bonding a plurality of ceramic cylindrical type sputtering target materials to a backing tube with a bonding material, at least one of the target materials being 500 to less than 750 nm long and having a relative density of 95% or larger, and the ceramic cylindrical type sputtering target being one piece comprising the ceramic cylindrical type sputtering target materials. A ceramic cylindrical type sputtering target material is made of ITO containing 1-10 mass% of Sn in terms of an amount of SnO, AZO containing 0.1-5 mass% of Al in terms of an amount of AlO,or IGZO containing 40-60 mass% of In in terms of an amount of InO, 20-50 mass% of Ga in terms of an amount of GaO, and 5-30 mass% of Zn in terms of amount of ZnO.
【課題】高密度で長尺のセラミックス円筒形スパッタリングターゲットの提供。【解決手段】セラミックス円筒形スパッタリングターゲット材をバッキングチューブにボンディング材によって、複数本接合してなるセラミックス円筒形スパッタリングターゲットで、ターゲット材の内少なくとも１本は長さ５００〜７５０ｍｍ未満かつ相対密度が９５％以上で、一体品のセラミックス円筒形スパッタリングターゲット材のセラミックス円筒形スパッタリングターゲット。セラミックス円筒形スパッタリングターゲット材が、Ｓｎの含有量がＳｎＯ２量換算で１〜１０質量％のＩＴＯ製又は、Ａｌの含有量がＡｌ２Ｏ３量換算で０．１〜５質量％のＡＺＯ製或いはＩｎの含有量がＩｎ２Ｏ３量換算で４０〜６０質量％、Ｇａの含有量がＧａ２Ｏ３量換算で２０〜５０質量％、Ｚｎの含有量がＺｎＯ量換算で５〜３０質量％のＩＧＺＯ製であるセラミックス円筒形スパッタリングターゲット。【選択図】なし
CERAMIC CYLINDRICAL TYPE SPUTTERING TARGET MATERIAL, AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a ceramic cylindrical type sputtering target material which is long-sized and has high density.SOLUTION: There is provided a ceramic cylindrical type sputtering target formed by bonding a plurality of ceramic cylindrical type sputtering target materials to a backing tube with a bonding material, at least one of the target materials being 500 to less than 750 nm long and having a relative density of 95% or larger, and the ceramic cylindrical type sputtering target being one piece comprising the ceramic cylindrical type sputtering target materials. A ceramic cylindrical type sputtering target material is made of ITO containing 1-10 mass% of Sn in terms of an amount of SnO, AZO containing 0.1-5 mass% of Al in terms of an amount of AlO,or IGZO containing 40-60 mass% of In in terms of an amount of InO, 20-50 mass% of Ga in terms of an amount of GaO, and 5-30 mass% of Zn in terms of amount of ZnO.
【課題】高密度で長尺のセラミックス円筒形スパッタリングターゲットの提供。【解決手段】セラミックス円筒形スパッタリングターゲット材をバッキングチューブにボンディング材によって、複数本接合してなるセラミックス円筒形スパッタリングターゲットで、ターゲット材の内少なくとも１本は長さ５００〜７５０ｍｍ未満かつ相対密度が９５％以上で、一体品のセラミックス円筒形スパッタリングターゲット材のセラミックス円筒形スパッタリングターゲット。セラミックス円筒形スパッタリングターゲット材が、Ｓｎの含有量がＳｎＯ２量換算で１〜１０質量％のＩＴＯ製又は、Ａｌの含有量がＡｌ２Ｏ３量換算で０．１〜５質量％のＡＺＯ製或いはＩｎの含有量がＩｎ２Ｏ３量換算で４０〜６０質量％、Ｇａの含有量がＧａ２Ｏ３量換算で２０〜５０質量％、Ｚｎの含有量がＺｎＯ量換算で５〜３０質量％のＩＧＺＯ製であるセラミックス円筒形スパッタリングターゲット。【選択図】なし
CERAMIC CYLINDRICAL TYPE SPUTTERING TARGET MATERIAL, AND METHOD OF MANUFACTURING THE SAME
セラミックス円筒形スパッタリングターゲット材およびその製造方法
MAZAKI TAKANORI (author) / ISHIDA SHINTARO (author)
2016-01-28
Patent
Electronic Resource
Japanese
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