A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
MATERIAL FOR CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD OF CERAMIC CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide a material for a ceramic circuit board which hardly generates irregularities produced at a circuit pattern peripheral edge of a ceramic circuit board, and a manufacturing method of a ceramic circuit board.SOLUTION: The material for a ceramic circuit board includes, over a ceramic substrate 1, a metal plate 3 and an etching resist film 4 covering the metal plate, and is used for forming a circuit pattern by etching the metal plate. The etching resist film has an average thickness T1 at a center part of the circuit pattern of 32-60 μm, while a maximum thickness T2 at a circuit pattern peripheral edge is thicker than the average thickness at the center part of the circuit pattern by 5 μm or more.SELECTED DRAWING: Figure 2
【課題】セラミックス回路基板の回路パターン周縁部に発生する凹凸を生じにくいセラミックス回路基板用素材およびセラミックス回路基板の製造方法を提供する。【解決手段】セラミック回路基板用素材は、セラミックス基板１上に金属板３と、前記金属板を被覆したエッチングレジスト膜４とを備え、前記金属板をエッチングして回路パターンを形成するためのセラミックス回路基板用素材であって、前記エッチングレジスト膜は、回路パターン中央部における平均厚さＴ１が３２μｍ〜６０μｍであり、回路パターン周縁部における最大厚さＴ２が回路パターン中央部における平均厚さよりも５μｍ以上厚いものである。【選択図】図２
MATERIAL FOR CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD OF CERAMIC CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide a material for a ceramic circuit board which hardly generates irregularities produced at a circuit pattern peripheral edge of a ceramic circuit board, and a manufacturing method of a ceramic circuit board.SOLUTION: The material for a ceramic circuit board includes, over a ceramic substrate 1, a metal plate 3 and an etching resist film 4 covering the metal plate, and is used for forming a circuit pattern by etching the metal plate. The etching resist film has an average thickness T1 at a center part of the circuit pattern of 32-60 μm, while a maximum thickness T2 at a circuit pattern peripheral edge is thicker than the average thickness at the center part of the circuit pattern by 5 μm or more.SELECTED DRAWING: Figure 2
【課題】セラミックス回路基板の回路パターン周縁部に発生する凹凸を生じにくいセラミックス回路基板用素材およびセラミックス回路基板の製造方法を提供する。【解決手段】セラミック回路基板用素材は、セラミックス基板１上に金属板３と、前記金属板を被覆したエッチングレジスト膜４とを備え、前記金属板をエッチングして回路パターンを形成するためのセラミックス回路基板用素材であって、前記エッチングレジスト膜は、回路パターン中央部における平均厚さＴ１が３２μｍ〜６０μｍであり、回路パターン周縁部における最大厚さＴ２が回路パターン中央部における平均厚さよりも５μｍ以上厚いものである。【選択図】図２
MATERIAL FOR CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD OF CERAMIC CIRCUIT BOARD
セラミックス回路基板用素材およびセラミックス回路基板の製造方法
IMAMURA TOSHIYUKI (author)
2016-12-22
Patent
Electronic Resource
Japanese
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