A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC CONJUGATE AND DIELECTRIC CIRCUIT BOARD
To provide a copper/ceramic conjugate and a circuit board having high bond strength, hard to form a crack in the ceramic substrate under cooling/heating cycle load, and especially excellent cooling/heating cycle reliability.SOLUTION: A copper/ceramic conjugate involving a copper member composed of copper or a copper alloy, bonded with a ceramic member composed of a silicon-containing ceramic, wherein the maximum indentation hardness in a region from a bond interface of the copper member and the ceramic member to a region from 10 μm to 50 μm to the copper member side is 70 mgf/μm2 or over and 150 mgf/μm2 or under.SELECTED DRAWING: None
【課題】接合強度が高く、かつ、冷熱サイクル負荷時にもセラミックス基板にクラックが生じにくく、冷熱サイクル信頼性に特に優れた銅／セラミックス接合体、及び、絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材と、ケイ素含有セラミックスからなるセラミックス部材とが接合されてなる銅／セラミックス接合体であって、前記銅部材と前記セラミックス部材との接合界面から前記銅部材側へ１０μｍから５０μｍまでの領域における最大押し込み硬さが７０ｍｇｆ／μｍ２以上１５０ｍｇｆ／μｍ２以下の範囲内とされていることを特徴とする。【選択図】なし
COPPER/CERAMIC CONJUGATE AND DIELECTRIC CIRCUIT BOARD
To provide a copper/ceramic conjugate and a circuit board having high bond strength, hard to form a crack in the ceramic substrate under cooling/heating cycle load, and especially excellent cooling/heating cycle reliability.SOLUTION: A copper/ceramic conjugate involving a copper member composed of copper or a copper alloy, bonded with a ceramic member composed of a silicon-containing ceramic, wherein the maximum indentation hardness in a region from a bond interface of the copper member and the ceramic member to a region from 10 μm to 50 μm to the copper member side is 70 mgf/μm2 or over and 150 mgf/μm2 or under.SELECTED DRAWING: None
【課題】接合強度が高く、かつ、冷熱サイクル負荷時にもセラミックス基板にクラックが生じにくく、冷熱サイクル信頼性に特に優れた銅／セラミックス接合体、及び、絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材と、ケイ素含有セラミックスからなるセラミックス部材とが接合されてなる銅／セラミックス接合体であって、前記銅部材と前記セラミックス部材との接合界面から前記銅部材側へ１０μｍから５０μｍまでの領域における最大押し込み硬さが７０ｍｇｆ／μｍ２以上１５０ｍｇｆ／μｍ２以下の範囲内とされていることを特徴とする。【選択図】なし
COPPER/CERAMIC CONJUGATE AND DIELECTRIC CIRCUIT BOARD
銅／セラミックス接合体、及び、絶縁回路基板
TERASAKI NOBUYUKI (author)
2021-07-01
Patent
Electronic Resource
Japanese
CERAMIC-METAL CONJUGATE AND MANUFACTURING METHOD THEREOF, DIELECTRIC CIRCUIT BOARD, AND POWER MODULE
| European Patent Office | 2022