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COPPER/CERAMIC JOINT AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic joint with excellent cold-heat cycle reliability by suppressing the occurrence of cracks in the ceramic member even when subjected to severe cold-heat cycles, and to provide an insulated circuit board made of the copper/ceramic joint.SOLUTION: A copper/ceramic joint formed by joining a ceramic member 11 with a copper member 12 made of copper or a copper alloy, in which the total concentration of Al, Si, Zn and Mn is 3% or less, based on the total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn and Mn is 100 atom%, as measured by energy dispersive X-ray analysis at a position 1,000 nm away from a bonding interface between the copper member 12 and the ceramic member 11 toward the copper member 12.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体、及び、この銅／セラミックス接合体からなる絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、銅部材１２とセラミックス部材１１との接合界面から銅部材１２側へ１０００ｎｍ離間した位置でエネルギー分散Ｘ線分析法により濃度測定を行い、Ｃｕ，Ｍｇ，Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆ，Ａｌ,Ｓｉ，Ｚｎ，Ｍｎの合計値を１００原子％としたときに、Ａｌ，Ｓｉ，Ｚｎ，Ｍｎの合計濃度が３原子％以下とされている。【選択図】図２
COPPER/CERAMIC JOINT AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic joint with excellent cold-heat cycle reliability by suppressing the occurrence of cracks in the ceramic member even when subjected to severe cold-heat cycles, and to provide an insulated circuit board made of the copper/ceramic joint.SOLUTION: A copper/ceramic joint formed by joining a ceramic member 11 with a copper member 12 made of copper or a copper alloy, in which the total concentration of Al, Si, Zn and Mn is 3% or less, based on the total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn and Mn is 100 atom%, as measured by energy dispersive X-ray analysis at a position 1,000 nm away from a bonding interface between the copper member 12 and the ceramic member 11 toward the copper member 12.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体、及び、この銅／セラミックス接合体からなる絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、銅部材１２とセラミックス部材１１との接合界面から銅部材１２側へ１０００ｎｍ離間した位置でエネルギー分散Ｘ線分析法により濃度測定を行い、Ｃｕ，Ｍｇ，Ｔｉ，Ｚｒ，Ｎｂ，Ｈｆ，Ａｌ,Ｓｉ，Ｚｎ，Ｍｎの合計値を１００原子％としたときに、Ａｌ，Ｓｉ，Ｚｎ，Ｍｎの合計濃度が３原子％以下とされている。【選択図】図２
COPPER/CERAMIC JOINT AND INSULATED CIRCUIT BOARD
銅／セラミックス接合体、及び、絶縁回路基板
TERASAKI NOBUYUKI (author)
2021-03-11
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2021