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WAFER SUPPORT
A wafer support includes a base material including a machinable ceramic, a protective layer covering a surface of the base material, and conductive members and placed at least partially inside the base material. The protective layer includes a material that is less corrodible by plasma than the base material.
WAFER SUPPORT
A wafer support includes a base material including a machinable ceramic, a protective layer covering a surface of the base material, and conductive members and placed at least partially inside the base material. The protective layer includes a material that is less corrodible by plasma than the base material.
WAFER SUPPORT
YAMAGISHI WATARU (Autor:in) / MORI KAZUMASA (Autor:in) / KOUNO HITOSHI (Autor:in) / ETO SHUNICHI (Autor:in)
30.05.2024
Patent
Elektronische Ressource
Englisch