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Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide
A resin composition for printed circuit board contains a thermosetting resin and an inorganic filler containing magnesium oxide. A volume average particle size of the magnesium oxide is from 2 μm to 10 μm, inclusive. In a distribution of a particle size of the magnesium oxide, the particle size has maximal frequencies in a first range of from 0.3 μm to 1 μm, inclusive, and in a second range of from 2 μm to 10 μm, inclusive, a maximal volume frequency in the first range is 5% or less, and a maximal volume frequency in the second range is 12% or more. A ratio of 50% accumulated particle size D50 with respect to specific surface area diameter of the magnesium oxide is 4 or less, and a ratio of 90% accumulated particle size D90 with respect to 10% accumulated particle size D10 of the magnesium oxide is 10 or less.
Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide
A resin composition for printed circuit board contains a thermosetting resin and an inorganic filler containing magnesium oxide. A volume average particle size of the magnesium oxide is from 2 μm to 10 μm, inclusive. In a distribution of a particle size of the magnesium oxide, the particle size has maximal frequencies in a first range of from 0.3 μm to 1 μm, inclusive, and in a second range of from 2 μm to 10 μm, inclusive, a maximal volume frequency in the first range is 5% or less, and a maximal volume frequency in the second range is 12% or more. A ratio of 50% accumulated particle size D50 with respect to specific surface area diameter of the magnesium oxide is 4 or less, and a ratio of 90% accumulated particle size D90 with respect to 10% accumulated particle size D10 of the magnesium oxide is 10 or less.
Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide
MATSUDA TAKASHI (author)
2016-10-11
Patent
Electronic Resource
English
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
/
C01F
COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
,
Verbindungen der Metalle Beryllium, Magnesium, Aluminium, Calcium, Strontium, Barium, Radium, Thorium oder der Seltenen Erden
/
C04B
Kalk
,
LIME
/
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
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