A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
This application relates to a method for manufacturing a printed circuit board. According to the present application, it is possible to manufacture a printed circuit board having excellent bonding strength between a ceramic substrate and a metal sheet, and the manufacturing cost thereof can be reduced.
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE
PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ
LEE JUN HO (author) / CHO NAM TAE (author) / TSUSHIMA EIKI (author)
2025-01-22
Patent
Electronic Resource
English
IPC:
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
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