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    INTERPOSER SUBSTRATE, METHOD FOR MANUFACTURING INTERPOSER SUBSTRATE, CORE SUBSTRATE, AND METHOD FOR MANUFACTURING CORE SUBSTRATE

    New search for: UMAYAHARA YOSHIO

    Provided are an interposer substrate and a core substrate having low dielectric characteristics (relative dielectric constant, dielectric loss tangent) and high laser machining characteristics.　An interposer substrate according to the present invention is characterized by containing glass and SiO2 crystals.

    L'invention concerne un substrat interposeur et un substrat central ayant de faibles caractéristiques diélectriques (constante diélectrique relative, tangente de perte diélectrique) et des caractéristiques d'usinage laser élevées.　Un substrat interposeur selon la présente invention est caractérisé en ce qu'il contient du verre et des cristaux de SiO2.

    低い誘電特性（比誘電率、誘電正接）と高いレーザー加工性を有するインターポーザ基板、コア基板を提供する。　本発明のインターポーザ基板は、ガラスとＳｉＯ２結晶を含有することを特徴とする。

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    INTERPOSER SUBSTRATE, METHOD FOR MANUFACTURING INTERPOSER SUBSTRATE, CORE SUBSTRATE, AND METHOD FOR MANUFACTURING CORE SUBSTRATE

    New search for: UMAYAHARA YOSHIO

    Provided are an interposer substrate and a core substrate having low dielectric characteristics (relative dielectric constant, dielectric loss tangent) and high laser machining characteristics.　An interposer substrate according to the present invention is characterized by containing glass and SiO2 crystals.

    L'invention concerne un substrat interposeur et un substrat central ayant de faibles caractéristiques diélectriques (constante diélectrique relative, tangente de perte diélectrique) et des caractéristiques d'usinage laser élevées.　Un substrat interposeur selon la présente invention est caractérisé en ce qu'il contient du verre et des cristaux de SiO2.

    低い誘電特性（比誘電率、誘電正接）と高いレーザー加工性を有するインターポーザ基板、コア基板を提供する。　本発明のインターポーザ基板は、ガラスとＳｉＯ２結晶を含有することを特徴とする。

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    INTERPOSER SUBSTRATE, METHOD FOR MANUFACTURING INTERPOSER SUBSTRATE, CORE SUBSTRATE, AND METHOD FOR MANUFACTURING CORE SUBSTRATE

    New search for: UMAYAHARA YOSHIO

    Provided are an interposer substrate and a core substrate having low dielectric characteristics (relative dielectric constant, dielectric loss tangent) and high laser machining characteristics.　An interposer substrate according to the present invention is characterized by containing glass and SiO2 crystals.

    L'invention concerne un substrat interposeur et un substrat central ayant de faibles caractéristiques diélectriques (constante diélectrique relative, tangente de perte diélectrique) et des caractéristiques d'usinage laser élevées.　Un substrat interposeur selon la présente invention est caractérisé en ce qu'il contient du verre et des cristaux de SiO2.

    低い誘電特性（比誘電率、誘電正接）と高いレーザー加工性を有するインターポーザ基板、コア基板を提供する。　本発明のインターポーザ基板は、ガラスとＳｉＯ２結晶を含有することを特徴とする。

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    Title:

    INTERPOSER SUBSTRATE, METHOD FOR MANUFACTURING INTERPOSER SUBSTRATE, CORE SUBSTRATE, AND METHOD FOR MANUFACTURING CORE SUBSTRATE

    Additional title:

    SUBSTRAT INTERPOSEUR, PROCÉDÉ DE FABRICATION DE SUBSTRAT INTERPOSEUR, SUBSTRAT CENTRAL ET PROCÉDÉ DE FABRICATION DE SUBSTRAT CENTRAL
    インターポーザ基板、インターポーザ基板の製造方法、コア基板、及びコア基板の製造方法

    Contributors:

    UMAYAHARA YOSHIO (author)

    Publication date:

    2025-01-02

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    Japanese

    Classification:

    IPC:  C03C Chemische Zusammensetzungen für Gläser, Glasuren oder Emails , CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS / C04B Kalk , LIME / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen

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