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Effect of Annealing At High Hydrostatic Pressure of Silicon Implanted with Helium and Oxygen
Abstract The effect of heat treatment (up to 1570 K) under hydrostatic argon pressure (up to 1.2 GPa) on silicon implanted with helium and oxygen was investigated by transmission electron microscopy, X-ray diffraction and related methods. The treatment results in specific stress-related changes of Si/Si:He/Si and Si/Si:O/Si structures, especially in dislocation density. Such investigations can help in understanding the effect of stress at the layer/substrate interface during epitaxial growth and thermal treatment.
Effect of Annealing At High Hydrostatic Pressure of Silicon Implanted with Helium and Oxygen
Abstract The effect of heat treatment (up to 1570 K) under hydrostatic argon pressure (up to 1.2 GPa) on silicon implanted with helium and oxygen was investigated by transmission electron microscopy, X-ray diffraction and related methods. The treatment results in specific stress-related changes of Si/Si:He/Si and Si/Si:O/Si structures, especially in dislocation density. Such investigations can help in understanding the effect of stress at the layer/substrate interface during epitaxial growth and thermal treatment.
Effect of Annealing At High Hydrostatic Pressure of Silicon Implanted with Helium and Oxygen
Misiuk, A. (author) / Katcki, J. (author) / Ratajczak, J. (author) / Raineri, V. (author) / Bak-Misiuk, J. (author) / Gawlik, L. (author) / Bryja, L. (author) / Jun, J. (author)
2002-01-01
10 pages
Article/Chapter (Book)
Electronic Resource
English
High Hydrostatic Pressure , Heteroepitaxial Structure , High Pressure Anneal , High Oxygen Dose , Interstitial Oxygen Concentration Physics , Physics, general , Electronics and Microelectronics, Instrumentation , Surfaces and Interfaces, Thin Films , Characterization and Evaluation of Materials , Physical Chemistry , Condensed Matter Physics
Effect of uniform stress on silicon implanted with helium, hydrogen and oxygen
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