Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Wafer-scale Encapsulation: Controlling MEMS Packaging Costs
Wafer-scale Encapsulation: Controlling MEMS Packaging Costs
Wafer-scale Encapsulation: Controlling MEMS Packaging Costs
Markunas, B. (Autor:in)
ADVANCED PACKAGING ; 11 ; S11-S14
01.01.2002
S11-S14
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
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