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Reactive Ion Etching Process of 4H-SiC Using the CHF~3/O~2 Mixtures and a Post-O~2 Plasma-Etching Process
Reactive Ion Etching Process of 4H-SiC Using the CHF~3/O~2 Mixtures and a Post-O~2 Plasma-Etching Process
Reactive Ion Etching Process of 4H-SiC Using the CHF~3/O~2 Mixtures and a Post-O~2 Plasma-Etching Process
Kang, S. C. (Autor:in) / Shin, M. W. (Autor:in)
MATERIALS SCIENCE FORUM ; 389/393 ; 949-952
01.01.2002
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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