Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging: Fid-Bau Portal

Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

Yoon, J. W. / Lee, C. B. / Jung, S. B.

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Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

Yoon, J. W. / Lee, C. B. / Jung, S. B.

Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

Yoon, J. W. / Lee, C. B. / Jung, S. B.

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Titel:

Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

Beteiligte:

Yoon, J. W. (Autor:in) / Lee, C. B. (Autor:in) / Jung, S. B. (Autor:in) / Kang, S.-G. / Kobayashi, T.

Erschienen in:

Designing, Processing and Properties of Advanced Engineering Materials PART 2 ; 893-896

MATERIALS SCIENCE FORUM ; 449/452

Erscheinungsdatum:

01.01.2004

Format / Umfang:

4 pages

ISSN:

0255-5476

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Kang, H.-B. / Lee, J.-W. / Bae, J.-H. et al. | British Library Online Contents | 2008

Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

Yoon, J. W. / Jung, S. B. | British Library Online Contents | 2004

Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder

Nishikawa, H. / Komatsu, A. / Takemoto, T. | British Library Online Contents | 2008

Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder

Lee, C.-B. / Jung, S.-B. / Shin, Y.-E. et al. | British Library Online Contents | 2002

Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

Kumar, A. / Chen, Z. | British Library Online Contents | 2006

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