Interfacial reactions of Sn-Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages

Islam, M. N. / Chan, Y. C. | British Library Online Contents | 2005

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

Zhong, W. H. / Chan, Y. C. / Wu, B. Y. et al. | British Library Online Contents | 2007

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

Chang, K.-C. / Chiang, K.-N. | British Library Online Contents | 2006

Thermal fatigue life prediction of solder joints of plastic ball grid array packages

Chu, Yin Fun / Yi, Sung / Geng, Phil | British Library Online Contents | 2014

Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages

Jen, Y. M. / Chien, H. H. / Lin, T. S. et al. | British Library Online Contents | 2006