Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model: Fid-Bau Portal

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

Chang, K.-C. / Chiang, K.-N.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

Chang, K.-C. / Chiang, K.-N.

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

Chang, K.-C. / Chiang, K.-N.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

Beteiligte:

Chang, K.-C. (Autor:in) / Chiang, K.-N. (Autor:in)

Erschienen in:

JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN ; 41 ; 19-30

Erscheinungsdatum:

01.01.2006

Format / Umfang:

12 pages

ISSN:

0309-3247

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 624.176

Yeh, M. K. / Lee, I. S. | British Library Online Contents | 2006

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

Zhong, W. H. / Chan, Y. C. / Wu, B. Y. et al. | British Library Online Contents | 2007

Interfacial reactions of Sn-Cu and Sn-Pb-Ag solder with Au/Ni during extended time reflow in ball grid array packages

Islam, M. N. / Chan, Y. C. / Sharif, A. | British Library Online Contents | 2004

Interfacial reactions of Sn-Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages

Islam, M. N. / Chan, Y. C. | British Library Online Contents | 2005

Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging

Yoon, J. W. / Jung, S. B. | British Library Online Contents | 2007

Nach oben