Interfacial reactions of Sn-Cu and Sn-Pb-Ag solder with Au/Ni during extended time reflow in ball grid array packages

Islam, M. N. / Chan, Y. C. / Sharif, A. | British Library Online Contents | 2004

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

Zhong, W. H. / Chan, Y. C. / Wu, B. Y. et al. | British Library Online Contents | 2007

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global-local finite element model

Chang, K.-C. / Chiang, K.-N. | British Library Online Contents | 2006

Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging

Yoon, J.-W. / Chun, H.-S. / Lee, H.-J. et al. | British Library Online Contents | 2007

Thermal fatigue life prediction of solder joints of plastic ball grid array packages

Chu, Yin Fun / Yi, Sung / Geng, Phil | British Library Online Contents | 2014