Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Fundamental characterization of the effect of nitride sidewall spacer process on boron dose loss in ultra-shallow junction formation
Fundamental characterization of the effect of nitride sidewall spacer process on boron dose loss in ultra-shallow junction formation
Fundamental characterization of the effect of nitride sidewall spacer process on boron dose loss in ultra-shallow junction formation
Kohli, P. (Autor:in) / Chakravarthi, S. (Autor:in) / Jain, A. (Autor:in) / Bu, H. (Autor:in) / Mehrotra, M. (Autor:in) / Dunham, S. T. (Autor:in) / Banerjee, S. K. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 114/115 ; 390-396
01.01.2004
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
The influence of impurity profile on ultra-shallow GaAs sidewall tunnel junction characteristics
British Library Online Contents | 2006
|British Library Online Contents | 2008
|Ultra-Shallow Junction Formation Using Rapid Thermal Processing
British Library Online Contents | 2008
|British Library Online Contents | 2003
|British Library Online Contents | 2008
|