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Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow

Shao, T. L. / Chen, T. S. / Huang, Y. M. / Chen, C.

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Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow

Shao, T. L. / Chen, T. S. / Huang, Y. M. / Chen, C.

Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow

Shao, T. L. / Chen, T. S. / Huang, Y. M. / Chen, C.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Ähnliche Titel

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Titel:

Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow

Beteiligte:

Shao, T. L. (Autor:in) / Chen, T. S. (Autor:in) / Huang, Y. M. (Autor:in) / Chen, C. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 3654-3664

Erscheinungsdatum:

01.01.2004

Format / Umfang:

11 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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