Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM: Fid-Bau Portal

Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM

Kim, D. G. / Kim, J. W. / Jung, S. B.

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Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM

Kim, D. G. / Kim, J. W. / Jung, S. B.

Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM

Kim, D. G. / Kim, J. W. / Jung, S. B.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM

Beteiligte:

Kim, D. G. (Autor:in) / Kim, J. W. (Autor:in) / Jung, S. B. (Autor:in)

Erschienen in:

MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 121 ; 204-210

Erscheinungsdatum:

01.01.2005

Format / Umfang:

7 pages

ISSN:

0921-5107

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Tseng, C. F. / Duh, J. G. | British Library Online Contents | 2013

Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

Chen, W. Y. / Yu, C. Y. / Duh, J. G. | British Library Online Contents | 2012

Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Yahaya, Muhamad Zamri / Ani, Fakhrozi Che / Samsudin, Zambri et al. | British Library Online Contents | 2016

Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Yahaya, M. Z. / Ani, F. C. / Samsudin, Z. et al. | British Library Online Contents | 2016

Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder

Cheng, F.J. / Nishikawa, H. / Takemoto, T. | British Library Online Contents | 2008

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