Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging: Fid-Bau Portal

Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

Chen, W. Y. / Yu, C. Y. / Duh, J. G.

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Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

Chen, W. Y. / Yu, C. Y. / Duh, J. G.

Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

Chen, W. Y. / Yu, C. Y. / Duh, J. G.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

Beteiligte:

Chen, W. Y. (Autor:in) / Yu, C. Y. (Autor:in) / Duh, J. G. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS SCIENCE ; 47 ; 4012-4018

Erscheinungsdatum:

01.01.2012

Format / Umfang:

7 pages

ISSN:

0022-2461

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Gao, F. / Cheng, F. / Nishikawa, H. et al. | British Library Online Contents | 2008

Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM

Kim, D. G. / Kim, J. W. / Jung, S. B. | British Library Online Contents | 2005

Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Yahaya, Muhamad Zamri / Ani, Fakhrozi Che / Samsudin, Zambri et al. | British Library Online Contents | 2016

Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

Wang, M. / Wang, J. / Feng, H. et al. | British Library Online Contents | 2012

Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Yahaya, M. Z. / Ani, F. C. / Samsudin, Z. et al. | British Library Online Contents | 2016

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