Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM

Kim, D. G. / Jang, H. S. / Kim, J. W. et al. | British Library Online Contents | 2005

Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Jang, J.-W. / De Silva, A. P. / Lin, J.-K. et al. | British Library Online Contents | 2004

A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps

Huang, J. T. / Chao, P. S. / Hsu, H. J. et al. | British Library Online Contents | 2007

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

Kang, S. K. / Cho, M. G. / Lauro, P. et al. | British Library Online Contents | 2007

Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method

Kim, D.-G. / Jung, S.-B. | British Library Online Contents | 2005