A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates: Fid-Bau Portal

A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates

Lin, Y.C. / Chen, X. / Liu, X.S. / Lu, G.Q.

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A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates

Lin, Y.C. / Chen, X. / Liu, X.S. / Lu, G.Q.

A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates

Lin, Y.C. / Chen, X. / Liu, X.S. / Lu, G.Q.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Ähnliche Titel

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Titel:

A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates

Beteiligte:

Lin, Y.C. (Autor:in) / Chen, X. (Autor:in) / Liu, X.S. (Autor:in) / Lu, G.Q. (Autor:in) / Zhou, Y. / Tu, S.-T. / Xie, X.

Erschienen in:

Progresses in Fracture and Strength of Materials and Structures: Part 4: Selected, peer reviewed papers from the Asian Pacific Conference Fracture and Strength 2006 (APCFS'06), held at Sanya, Hainan Island, China during November 22˜25, 2006 ; 2932-2935

KEY ENGINEERING MATERIALS ; 353/358

Erscheinungsdatum:

01.01.2007

Format / Umfang:

4 pages

ISSN:

1013-9826

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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