Assembly & Reliability of Flip Chip-on-Laminate with Lead Free Solder

Hou, Z. / Tian, G. / Hatcher, C. et al. | British Library Online Contents | 2002

Flip Chip Solder Joint Failure Modes - High Electric Current Density Testing

Basaran, C. / Ye, H. / Hopkins, D. C. et al. | British Library Online Contents | 2005

Shear test parameters for brittle fracture of flip chip solder joint

Ha, S.-S. / Kim, J.-W. / Ha, S.-O. et al. | British Library Online Contents | 2011

A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates

Lin, Y.C. / Chen, X. / Liu, X.S. et al. | British Library Online Contents | 2007

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

Ye, H. / Basaran, C. / Hopkins, D. C. | British Library Online Contents | 2004