Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
Bang, H.S. (Autor:in) / Ji, H.J. (Autor:in) / Li, M.Y. (Autor:in) / Wang, C.Q. (Autor:in) / Lee, C. / Lee, J.-B. / Park, D.-H. / Na, S.-J.
01.01.2008
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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