Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization

Kaloyeros, A. E. / Eisenbraun, E. | British Library Online Contents | 2000

Ti-diffusion barrier in Cu-based metallization

Braud, F. / Torres, J. / Palleau, J. et al. | British Library Online Contents | 1996

Co-sputtered TiB~2 as a diffusion barrier for advanced microelectronics with Cu metallization

Sade, G. / Pelleg, J. | British Library Online Contents | 1996

Diffusion barrier performance of TiVCr alloy film in Cu metallization

Tsai, D. C. / Huang, Y. L. / Lin, S. R. et al. | British Library Online Contents | 2011

Ultrathin cobalt-alloyed barrier layers for copper metallization by a new seeding and electroless-deposition process

Chen, S. T. / Liu, Y. Y. / Chen, G. S. | British Library Online Contents | 2015