Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints
Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints
Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints
Shohji, I. (Autor:in) / Kobayashi, T. (Autor:in) / Tohei, T. (Autor:in) / Ariffin, A.K. / Abdullah, S. / Ali, A. / Muchtar, A. / Ghazali, M.J. / Sajuri, Z.
01.01.2011
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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