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    Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

    New search for: Chen, W. Y.
    New search for: Yu, C. Y.
    New search for: Duh, J. G.

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    Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

    New search for: Chen, W. Y.
    New search for: Yu, C. Y.
    New search for: Duh, J. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

    New search for: Chen, W. Y.
    New search for: Yu, C. Y.
    New search for: Duh, J. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

    Contributors:

    Chen, W. Y. (author) / Yu, C. Y. (author) / Duh, J. G. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 47 ; 4012-4018

    Publication date:

    2012-01-01

    Size:

    7 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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