Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

Shohji, I. / Shiratori, Y. / Yoshida, H. et al. | British Library Online Contents | 2004

Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints

Lin, Y. H. / Tsai, C. M. / Hu, Y. C. et al. | British Library Online Contents | 2005

Mesomechanical modelling of SnAgCu solder joints in flip chip

Gong, J. / Liu, C. / Conway, P. P. et al. | British Library Online Contents | 2008

Assembly & Reliability of Flip Chip-on-Laminate with Lead Free Solder

Hou, Z. / Tian, G. / Hatcher, C. et al. | British Library Online Contents | 2002

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

Ye, H. / Basaran, C. / Hopkins, D. C. | British Library Online Contents | 2004