A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints
Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints
Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints
Kim, S. H. (author) / Yu, J. (author)
MATERIALS LETTERS ; 106 ; 75-78
2013-01-01
4 pages
Article (Journal)
English
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints
| British Library Online Contents | 2010
Kirkendall voids in the intermetallic layers of solder joints in MEMS
| British Library Online Contents | 2009
Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints
| British Library Online Contents | 2011
Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints
| British Library Online Contents | 2007
Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow
| British Library Online Contents | 2005