Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT
Aiming at the problem of thermal fatigue of solder joints for airborne electronic equipment, the evaluation method of thermal fatigue life of solder joints suitable for engineering application was studied, considered that the empirical equation based on strain energy was suitable for multiple components on PCBA. The accelerated test method of thermal fatigue life of solder joints was discussed, the accelerated test case proved that the test was feasible, and the simulation was credible. The results indicated that the simulation and accelerated test method of thermal fatigue life of solder joints were suitable for engineering application.
RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT
Aiming at the problem of thermal fatigue of solder joints for airborne electronic equipment, the evaluation method of thermal fatigue life of solder joints suitable for engineering application was studied, considered that the empirical equation based on strain energy was suitable for multiple components on PCBA. The accelerated test method of thermal fatigue life of solder joints was discussed, the accelerated test case proved that the test was feasible, and the simulation was credible. The results indicated that the simulation and accelerated test method of thermal fatigue life of solder joints were suitable for engineering application.
RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT
CU QiangYi (Autor:in) / LIU ZhiHu (Autor:in) / TIAN Feng (Autor:in) / ZHANG FengHua (Autor:in) / ZHAO Gang (Autor:in) / WU Bo (Autor:in)
2022
Aufsatz (Zeitschrift)
Elektronische Ressource
Unbekannt
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