Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER-CERAMIC JOINED BODY, AND INSULATION CIRCUIT SUBSTRATE
In a copper-ceramic bonded body of the present invention, at a bonding interface of a copper member and a ceramic member, there are formed a nitride compound layer containing one or more nitride forming elements selected from Ti, Nb, Hf, and Zr, and an Ag-Cu eutectic layer, in order from the ceramic member side, the thickness of the nitride compound layer is 0.15 µm or more and 1.0 µm or less, an intermetallic compound phase formed of an intermetallic compound that contains the nitride forming element and Si is present between the copper member and the ceramic member, and Cu and Si are present at the grain boundary of the nitride compound layer.
COPPER-CERAMIC JOINED BODY, AND INSULATION CIRCUIT SUBSTRATE
In a copper-ceramic bonded body of the present invention, at a bonding interface of a copper member and a ceramic member, there are formed a nitride compound layer containing one or more nitride forming elements selected from Ti, Nb, Hf, and Zr, and an Ag-Cu eutectic layer, in order from the ceramic member side, the thickness of the nitride compound layer is 0.15 µm or more and 1.0 µm or less, an intermetallic compound phase formed of an intermetallic compound that contains the nitride forming element and Si is present between the copper member and the ceramic member, and Cu and Si are present at the grain boundary of the nitride compound layer.
COPPER-CERAMIC JOINED BODY, AND INSULATION CIRCUIT SUBSTRATE
KUPFER-KERAMIK-VERBUNDKÖRPER UND ISOLIERSCHALTSUBSTRAT
CORPS ASSEMBLÉ EN CUIVRE-CÉRAMIQUE ET SUBSTRAT DE CIRCUIT D'ISOLATION
TERASAKI NOBUYUKI (Autor:in)
29.01.2020
Patent
Elektronische Ressource
Englisch
COPPER-CERAMIC JOINED BODY, AND INSULATION CIRCUIT SUBSTRATE
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