Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC JOINED BODY, AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic joined body excellent in cooling and heating cycle reliability, and capable of suppressing generation of a break in a ceramic member even when loading a severe cooling and heating cycle, and an insulation circuit board composed of the copper/ceramic joined body.SOLUTION: A copper/ceramic joined body 10 is constituted by joining a copper member 12, 13 composed of copper or a copper alloy with a ceramic member 11, where the area ratio of an Ag solid solution part 12A, 13A having an Ag concentration of 0.5 mass% or more and 15 mass% or less is within a range of 0.03 or more and 0.35 or less in an end region E of the copper member 12, 13.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体、および、この銅／セラミックス接合体からなる絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、銅部材１２，１３の端部領域Ｅにおいて、Ａｇ濃度が０．５質量％以上１５質量％以下であるＡｇ固溶部１２Ａ，１３Ａの面積比が０．０３以上０．３５以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC JOINED BODY, AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic joined body excellent in cooling and heating cycle reliability, and capable of suppressing generation of a break in a ceramic member even when loading a severe cooling and heating cycle, and an insulation circuit board composed of the copper/ceramic joined body.SOLUTION: A copper/ceramic joined body 10 is constituted by joining a copper member 12, 13 composed of copper or a copper alloy with a ceramic member 11, where the area ratio of an Ag solid solution part 12A, 13A having an Ag concentration of 0.5 mass% or more and 15 mass% or less is within a range of 0.03 or more and 0.35 or less in an end region E of the copper member 12, 13.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体、および、この銅／セラミックス接合体からなる絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、銅部材１２，１３の端部領域Ｅにおいて、Ａｇ濃度が０．５質量％以上１５質量％以下であるＡｇ固溶部１２Ａ，１３Ａの面積比が０．０３以上０．３５以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC JOINED BODY, AND INSULATION CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
TERASAKI NOBUYUKI (Autor:in)
09.02.2023
Patent
Elektronische Ressource
Japanisch
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