Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC JOINED BODY, AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic joined body excellent in cooling and heating cycle reliability, and sufficiently suppressed in generation of solder stains, and an insulation circuit board composed of the copper/ceramic joined body.SOLUTION: A copper/ceramic joined body 10 is constituted by joining a copper member 12, 13 composed of copper or a copper alloy with a ceramic member 11, where the distance between the ceramic member 11 of an end part of the copper member 12, 13 and the copper member 12, 13 on a joining interface of the ceramic member 11 with the copper member 12, 13 is within a range of 3 μm or more and 30 μm or less, and the void ratio in an end region E of the copper member 12, 13 is 10% or less.SELECTED DRAWING: Figure 2
【課題】冷熱サイクル信頼性に優れ、かつ、ろう染みの発生が十分に抑制された銅／セラミックス接合体、および、この銅／セラミックス接合体からなる絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２，１３との接合界面において、銅部材１２，１３の端部におけるセラミックス部材１１と銅部材１２，１３との間の距離が３μｍ以上３０μｍ以下の範囲内とされるとともに、銅部材１２，１３の端部領域Ｅにおけるボイド率が１０％以下である。【選択図】図２
COPPER/CERAMIC JOINED BODY, AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic joined body excellent in cooling and heating cycle reliability, and sufficiently suppressed in generation of solder stains, and an insulation circuit board composed of the copper/ceramic joined body.SOLUTION: A copper/ceramic joined body 10 is constituted by joining a copper member 12, 13 composed of copper or a copper alloy with a ceramic member 11, where the distance between the ceramic member 11 of an end part of the copper member 12, 13 and the copper member 12, 13 on a joining interface of the ceramic member 11 with the copper member 12, 13 is within a range of 3 μm or more and 30 μm or less, and the void ratio in an end region E of the copper member 12, 13 is 10% or less.SELECTED DRAWING: Figure 2
【課題】冷熱サイクル信頼性に優れ、かつ、ろう染みの発生が十分に抑制された銅／セラミックス接合体、および、この銅／セラミックス接合体からなる絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２，１３との接合界面において、銅部材１２，１３の端部におけるセラミックス部材１１と銅部材１２，１３との間の距離が３μｍ以上３０μｍ以下の範囲内とされるとともに、銅部材１２，１３の端部領域Ｅにおけるボイド率が１０％以下である。【選択図】図２
COPPER/CERAMIC JOINED BODY, AND INSULATION CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
TERASAKI NOBUYUKI (Autor:in)
09.02.2023
Patent
Elektronische Ressource
Japanisch
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