Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR PRODUCING INSULATING CIRCUIT BOARD
This copper/ceramic bonded body (10) includes: a copper member (12, 13) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12, 13) and the ceramic member (11) are bonded to each other, in which, between the copper member (12, 13) and the ceramic member (11), an active metal nitride layer (41) containing nitrides of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a Mg solid solution layer (45) in which Mg is solid-dissolved in a Cu matrix is formed between the active metal nitride layer (41) and the copper member (12, 13), and Cu-containing particles (42) composed of either one or both of Cu particles and compound particles of Cu and the active metal are dispersed in an interior of the active metal nitride layer (41).
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR PRODUCING INSULATING CIRCUIT BOARD
This copper/ceramic bonded body (10) includes: a copper member (12, 13) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12, 13) and the ceramic member (11) are bonded to each other, in which, between the copper member (12, 13) and the ceramic member (11), an active metal nitride layer (41) containing nitrides of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a Mg solid solution layer (45) in which Mg is solid-dissolved in a Cu matrix is formed between the active metal nitride layer (41) and the copper member (12, 13), and Cu-containing particles (42) composed of either one or both of Cu particles and compound particles of Cu and the active metal are dispersed in an interior of the active metal nitride layer (41).
COPPER/CERAMIC BONDED BODY, INSULATING CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR PRODUCING INSULATING CIRCUIT BOARD
KUPFER-KERAMIK-FÜGEKÖRPER, ISOLIERENDE LEITERPLATTE, VERFAHREN ZUR HERSTELLUNG EINES KUPFER-KERAMIK-FÜGEKÖRPERS SOWIE VERFAHREN ZUR HERSTELLUNG EINER ISOLIERENDEN LEITERPLATTE
CORPS LIÉ DE CUIVRE/CÉRAMIQUE, CARTE DE CIRCUIT ISOLANTE, PROCÉDÉ DE PRODUCTION D'UN CORPS LIÉ DE CUIVRE/CÉRAMIQUE, ET PROCÉDÉ DE PRODUCTION D'UNE CARTE DE CIRCUIT ISOLANTE
TERASAKI NOBUYUKI (Autor:in)
27.03.2024
Patent
Elektronische Ressource
Englisch
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