A platform for research: civil engineering, architecture and urbanism
Planarized Copper Multilevel Interconnections for ULSI Applications
Planarized Copper Multilevel Interconnections for ULSI Applications
Planarized Copper Multilevel Interconnections for ULSI Applications
Misawa, N. (author) / Ohba, T. (author) / Yagi, H. (author)
MRS BULLETIN- MATERIALS RESEARCH SOCIETY ; 19 ; 63
1994-01-01
63 pages
Article (Journal)
Unknown
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Copper-Based Metallization for ULSI Applications
British Library Online Contents | 1993
|Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing
British Library Online Contents | 1993
|Copper-Based Metallization in ULSI Structures
British Library Online Contents | 1994
|Electrochemically Deposited Copper for ULSI Technology
British Library Conference Proceedings | 1995
|Materials Issues in Copper Interconnections
British Library Online Contents | 1994
|