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Scaling effects on microstructure and reliability for Cu interconnects
Scaling effects on microstructure and reliability for Cu interconnects
Scaling effects on microstructure and reliability for Cu interconnects
Ho, P.S. (author) / Zschech, E. (author) / Schmeisser, D. (author) / Meyer, M.A. (author) / Huebner, R. (author) / Hauschildt, M. (author) / Zhang, L. (author) / Gall, M. (author) / Kraatz, M. (author)
INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 101 ; 216-227
2010-01-01
12 pages
Article (Journal)
English
DDC:
669.9
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