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Wafer direct bonding of compound semiconductors and silicon at room temperature by the surface activated bonding method
Wafer direct bonding of compound semiconductors and silicon at room temperature by the surface activated bonding method
Wafer direct bonding of compound semiconductors and silicon at room temperature by the surface activated bonding method
Taek Ryong Chung (author) / Yang, L. (author) / Hosoda, N. (author) / Takagi, H. (author) / Suga, T. (author)
APPLIED SURFACE SCIENCE ; 117/118 ; 808-812
1997-01-01
5 pages
Article (Journal)
English
DDC:
621.35
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