Residual Stress of Aluminum Thin Films Sputtered on Silicon Wafers Measured by X-Ray Diffraction: Fid-Bau Portal

Residual Stress of Aluminum Thin Films Sputtered on Silicon Wafers Measured by X-Ray Diffraction

Tanaka, K. / Ishihara, K. / Akiniwa, Y.

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Residual Stress of Aluminum Thin Films Sputtered on Silicon Wafers Measured by X-Ray Diffraction

Tanaka, K. / Ishihara, K. / Akiniwa, Y.

Residual Stress of Aluminum Thin Films Sputtered on Silicon Wafers Measured by X-Ray Diffraction

Tanaka, K. / Ishihara, K. / Akiniwa, Y.

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Check availability in my library

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Document information

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Document information

Title:

Residual Stress of Aluminum Thin Films Sputtered on Silicon Wafers Measured by X-Ray Diffraction

Contributors:

Tanaka, K. (author) / Ishihara, K. (author) / Akiniwa, Y. (author)

Published in:

ADVANCES IN X RAY ANALYSIS ; 267-280

Publication date:

1997-01-01

Size:

14 pages

ISSN:

0376-0308

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 539.7222

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