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Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications
Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications
Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications
Chen, X. (author) / Peterson, G. G. (author) / Goldberg, C. (author) / Nuesca, G. (author) / Frisch, H. L. (author) / Kaloyeros, A. E. (author) / Arkles, B. (author) / Sullivan, J. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 14 ; 2043-2052
1999-01-01
10 pages
Article (Journal)
English
DDC:
620.11
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