Atomic layer deposition of tantalum nitride for ultrathin liner applications in advanced copper metallization schemes: Fid-Bau Portal

Atomic layer deposition of tantalum nitride for ultrathin liner applications in advanced copper metallization schemes

van der Straten, O. / Zhu, Y. / Dunn, K. / Eisenbraun, E. T. / Kaloyeros, A. E.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Atomic layer deposition of tantalum nitride for ultrathin liner applications in advanced copper metallization schemes

van der Straten, O. / Zhu, Y. / Dunn, K. / Eisenbraun, E. T. / Kaloyeros, A. E.

Atomic layer deposition of tantalum nitride for ultrathin liner applications in advanced copper metallization schemes

van der Straten, O. / Zhu, Y. / Dunn, K. / Eisenbraun, E. T. / Kaloyeros, A. E.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Atomic layer deposition of tantalum nitride for ultrathin liner applications in advanced copper metallization schemes

Contributors:

van der Straten, O. (author) / Zhu, Y. (author) / Dunn, K. (author) / Eisenbraun, E. T. (author) / Kaloyeros, A. E. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 447-453

Publication date:

2004-01-01

Size:

7 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Zhu, Y. / Dunn, K. A. / Kaloyeros, A. E. | British Library Online Contents | 2007

Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications

Chen, X. / Peterson, G. G. / Goldberg, C. et al. | British Library Online Contents | 1999

Preparation of TiN films by plasma assisted atomic layer deposition for copper metallization

Kim, D. H. / Kim, Y. J. / Park, J. H. et al. | British Library Online Contents | 2004

Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization

Kaloyeros, A. E. / Eisenbraun, E. | British Library Online Contents | 2000

Tantalum diffusion barrier grown by inorganic plasma-promoted chemical vapor deposition: Performance in copper metallization

Kaloyeros, A. E. / Chen, X. / Lane, S. et al. | British Library Online Contents | 2000