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Lower temperature and shorter curing time of methylsilsesquioxane for intermetal dielectric application
Lower temperature and shorter curing time of methylsilsesquioxane for intermetal dielectric application
Lower temperature and shorter curing time of methylsilsesquioxane for intermetal dielectric application
Chua, C. T. (author) / Sarkar, G. (author) / Chool, S. Y. M. (author) / Chan, L. (author)
JOURNAL OF MATERIALS SCIENCE LETTERS ; 18 ; 33-34
1998-01-01
2 pages
Article (Journal)
English
DDC:
620.11
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