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    Analysis and Study on CMP of Copper Interconnects for ULSI

    New search for: Wang, X.
    New search for: Yu, G.
    New search for: Liu, Y.-l.

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    Analysis and Study on CMP of Copper Interconnects for ULSI

    New search for: Wang, X.
    New search for: Yu, G.
    New search for: Liu, Y.-l.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Analysis and Study on CMP of Copper Interconnects for ULSI

    New search for: Wang, X.
    New search for: Yu, G.
    New search for: Liu, Y.-l.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Analysis and Study on CMP of Copper Interconnects for ULSI

    Contributors:

    Wang, X. (author) / Yu, G. (author) / Liu, Y.-l. (author)

    Published in:

    JOURNAL- HEBEI UNIVERSITY OF TECHNOLOGY ; 31 ; 33-37

    Publication date:

    2002-01-01

    Size:

    5 pages

    ISSN:

    1007-2373

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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