Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Chemical Mechanical Polish of Potential New Barrier Material Ruthenium (Ru) in ULSI Copper Interconnects

    New search for: Chu, X.F.
    New search for: Li, X.J.
    New search for: Dong, Y.P.
    New search for: Qiao, H.B.
    New search for: Bai, L.S.
    New search for: Zuo, D.
    New search for: Huang, C.
    New search for: Chen, M.
    New search for: Li, J.
    New search for: Hun, G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Chemical Mechanical Polish of Potential New Barrier Material Ruthenium (Ru) in ULSI Copper Interconnects

    New search for: Chu, X.F.
    New search for: Li, X.J.
    New search for: Dong, Y.P.
    New search for: Qiao, H.B.
    New search for: Bai, L.S.
    New search for: Zuo, D.
    New search for: Huang, C.
    New search for: Chen, M.
    New search for: Li, J.
    New search for: Hun, G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Chemical Mechanical Polish of Potential New Barrier Material Ruthenium (Ru) in ULSI Copper Interconnects

    New search for: Chu, X.F.
    New search for: Li, X.J.
    New search for: Dong, Y.P.
    New search for: Qiao, H.B.
    New search for: Bai, L.S.
    New search for: Zuo, D.
    New search for: Huang, C.
    New search for: Chen, M.
    New search for: Li, J.
    New search for: Hun, G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Chemical Mechanical Polish of Potential New Barrier Material Ruthenium (Ru) in ULSI Copper Interconnects

    Contributors:

    Chu, X.F. (author) / Li, X.J. (author) / Dong, Y.P. (author) / Qiao, H.B. (author) / Bai, L.S. (author) / Zuo, D. / Huang, C. / Chen, M. / Li, J. / Hun, G.

    Published in:

    Anti-Fatigue Design and Manufacturing Technologies I ; 33-38

    KEY ENGINEERING MATERIALS ; 499

    Publication date:

    2012-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Electromigration in ULSI interconnects

    Tan, C. M. / Roy, A. | British Library Online Contents | 2007

    Analysis and Study on CMP of Copper Interconnects for ULSI

    Wang, X. / Yu, G. / Liu, Y.-l. | British Library Online Contents | 2002

    Low Dielectric Constant Materials for ULSI Interconnects

    Morgen, M. / Ryan, E. T. / Zhao, J.-H. et al. | British Library Online Contents | 2000

    Chemical Mechanical Polishing of Silica Dielectric in ULSI Manufacturing

    Tan, B.-m. / Liu, Y.-l. / Lian, J. | British Library Online Contents | 2001

    Copper-Based Metallization in ULSI Structures

    Li, J. / Seidel, T. E. / Mayer, J. W. | British Library Online Contents | 1994

    Back to top