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    A study of copper chemical mechanical polishing in urea-hydrogen peroxide slurry by electrochemical impedance spectroscopy

    New search for: Tsai, T. H.
    New search for: Wu, Y. F.
    New search for: Yen, S. C.

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    A study of copper chemical mechanical polishing in urea-hydrogen peroxide slurry by electrochemical impedance spectroscopy

    New search for: Tsai, T. H.
    New search for: Wu, Y. F.
    New search for: Yen, S. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    A study of copper chemical mechanical polishing in urea-hydrogen peroxide slurry by electrochemical impedance spectroscopy

    New search for: Tsai, T. H.
    New search for: Wu, Y. F.
    New search for: Yen, S. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    A study of copper chemical mechanical polishing in urea-hydrogen peroxide slurry by electrochemical impedance spectroscopy

    Contributors:

    Tsai, T. H. (author) / Wu, Y. F. (author) / Yen, S. C. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 214 ; 120-135

    Publication date:

    2003-01-01

    Size:

    16 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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