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    Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing

    New search for: Watanabe, J.
    New search for: Hisamatsu, T.
    New search for: Hirano, M.
    New search for: Pearce, T.
    New search for: Gao, Y.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.

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    Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing

    New search for: Watanabe, J.
    New search for: Hisamatsu, T.
    New search for: Hirano, M.
    New search for: Pearce, T.
    New search for: Gao, Y.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing

    New search for: Watanabe, J.
    New search for: Hisamatsu, T.
    New search for: Hirano, M.
    New search for: Pearce, T.
    New search for: Gao, Y.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
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    Document information
    Title:

    Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing

    Contributors:

    Watanabe, J. (author) / Hisamatsu, T. (author) / Hirano, M. (author) / Pearce, T. / Gao, Y. / Tamaki, J. / Kuriyagawa, T.

    Published in:

    Advances in Abrasive Technology VI ; 407-412

    KEY ENGINEERING MATERIALS

    Publication date:

    2004-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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