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    Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

    New search for: Tian, Y.
    New search for: Hang, C.
    New search for: Wang, C.
    New search for: Yang, S.
    New search for: Lin, P.

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    Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

    New search for: Tian, Y.
    New search for: Hang, C.
    New search for: Wang, C.
    New search for: Yang, S.
    New search for: Lin, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

    New search for: Tian, Y.
    New search for: Hang, C.
    New search for: Wang, C.
    New search for: Yang, S.
    New search for: Lin, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

    Contributors:

    Tian, Y. (author) / Hang, C. (author) / Wang, C. (author) / Yang, S. (author) / Lin, P. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 529 ; 468-478

    Publication date:

    2011-01-01

    Size:

    11 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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